Patent Exhibition | A Method for Manufacturing Small-Diameter Wood-Based Panels

[Application Number] CN201610564638.7 [Application Date] 2016-07-18

[Publication Number] CN106182224A [Publication Date] 2016-12-07

[Applicant] Central South University of Forestry and Technology [Address] No. 498, Shaoshan South Road, Changsha, Hunan Province, 410004, China

[Inventors] Zhang Zhongfeng; Zhang Jijuan; Chen Yanan

[Patent Agency] Changsha Rongzhi Patent Agency 43114 [Agent] Deng Jianhui

[Country/Province Code] 43

[Abstract] This invention discloses a method for manufacturing small-diameter wood-based panels, comprising the following steps: (1) Material preparation: pressing Vitex negundo wood through barbed rollers at a pressure of 60-80 MPa to obtain Vitex negundo wood bundles; (2) drying the Vitex negundo wood bundles to a moisture content of 8-10%, then applying glue at a rate of 15-17%, using a mixed adhesive, wherein the mixed adhesive is prepared by mixing m phenolic resin adhesive: m polyisocyanate molecular adhesive = 1-6: 0.3 with phenolic resin adhesive. (3) Assembly method: The yellow chaste wood bundles are assembled in a cross-shaped manner; (4) Hot pressing: The assembled small-diameter wood-based panels are hot-pressed using a hot press machine. The hot pressing temperature is 140-160℃, the time is 1.1-1.3min/mm, and the pressure is 2.0-3.0MPa; (5) Edge sawing process: The hot-pressed small-diameter wood-based panels are edge sawed and inspected using an edge sawing machine according to the design requirements, and then put into storage.

[Claim 1] A method for manufacturing a small-diameter wood-based panel, characterized by comprising the following steps: (1) Material preparation: pressing Vitex negundo wood through barbed rollers at a pressure of 60 MPa to 80 MPa to obtain Vitex negundo wood bundles; (2) drying the Vitex negundo wood bundles to a moisture content of 8% to 10%, then applying glue, with a glue application amount of 15% to 17% by weight, and the glue type being a mixed adhesive, wherein the mixed adhesive is prepared by mixing phenolic resin adhesive and polyisocyanate molecular adhesive by weight according to the ratio of mphenolic resin adhesive: m polyisocyanate molecular adhesive = 1 to 6: 0.3; (3) Assembly method: Lay multiple bundles of Vitex negundo wood flat to form a layer of Vitex negundo wood bundle board, and then arrange at least two layers of Vitex negundo wood bundle board according to the principle of cross intersection between the upper layer of Vitex negundo wood bundle board and the lower layer of Vitex negundo wood bundle board; (4) Hot pressing: Hot press the assembled small-diameter wood-based panel blanks with a hot press machine. The hot pressing temperature is 140℃～160℃, the time is 1.1min/mm～1.3min/mm, and the pressure is 2.0MPa～3.0MPa; (5) Edge sawing process: According to the design requirements, use an edge sawing machine to saw the edges of the hot-pressed small-diameter wood-based panel, inspect it, and then put it into storage.